GOB is the abbreviation of GLUE ON THE BOARD glue. GOB process is a new type of optical heat-conducting nano-filling material. Through special process, the conventional LED display PCB board and its patch lamp beads and double matte optical treatment are used to achieve the frosted effect on the surface of the LED display, improve the existing protection technology of the LED display, and innovatively realize the conversion and display of the display point light source from the surface light source. It has a broad market in fields such as.
GOB technology solves industry pain points
Currently, traditional screens are completely exposed to the light source, which has serious defects.
1. Low protection level: not moisture-proof, waterproof, dust-proof, shock-proof, and collision-proof. In humid climates, a large number of dead lights and broken lights are prone to occur. Lights are easily dropped and broken during transportation. It is also easy to be affected by static electricity, causing dead lights.
2. Great damage to the eyes: long-term viewing will cause glare and fatigue, and the eyes will not be protected. In addition, there is a “blue damage” effect. Due to the short wavelength and high frequency of blue light LEDs, the human eye is directly affected by blue light for a long time, which is easy to cause retinal lesions.
Advantages of GOB technology
1. Eight protections: waterproof, moisture-proof, anti-collision, dust-proof, anti-corrosion, anti-blue light, anti-salt, and anti-static.
2. Due to the frosted surface effect, the color contrast is also increased, and the conversion display from viewpoint light source to surface light source is realized, which increases the viewing angle.
Detailed explanation of GOB process
GOB process truly meets the requirements of LED display product characteristics and can ensure standardized mass production of quality and performance.
It requires a complete production process, reliable automated production equipment developed in conjunction with production process research and development, a pair of A-type molds customized, and the development of packaging materials that meet the product characteristics requirements.
Cutting
The packaging material of GOB must be a customized material developed according to the process scheme of GOB, and must meet the following characteristics: 1. Strong adhesion; 2. Strong pulling force and vertical impact force; 3. Hardness; 4. High transparency; 5. Temperature resistance; 6. Yellowing resistance, 7. Salt spray resistance, 8. High wear resistance, 9. Antistatic, 10. High pressure resistance, etc.
Filling
The GOB packaging process should ensure that the packaging material completely fills the space between the lamp beads and covers the surface of the lamp beads, and is firmly attached to the PCB. There should be no bubbles, pinholes, white spots, gaps or bottom fillers. On the bonding surface of the PCB and glue.
Thickness shedding
The consistency of the thickness of the glue layer (precisely described as the consistency of the thickness of the glue layer on the surface of the lamp beads). After GOB packaging, the uniformity of the thickness of the glue layer on the surface of the lamp beads needs to be ensured. At present, the GOB process has been fully upgraded to 4.0, and there is almost no thickness tolerance of the glue layer. The thickness tolerance of the original module is as much as the thickness tolerance after the original module is completed. The thickness tolerance of the original module can even be reduced. Perfect joint flatness!
Leveling
The surface flatness of the GOB after packaging should be very good, and there should be no bumps, ripples, etc.
Surface peeling
Surface treatment of GOB containers. At present, the surface treatment in the industry is divided into matte, matte and mirror according to different product characteristics.
Maintenance switch
The repairability of the GOB after packaging should ensure that the packaging material is easy to remove under certain conditions, and the removed part can be filled and repaired after normal maintenance.
GOB technology supports various LED display screens:
Suitable for small-pitch LED display screens, ultra-protective rental LED display screens, ultra-protective floor-standing interactive LED display screens, ultra-protective transparent LED display screens, LED smart panel display screens, LED smart billboard display screens, LED creative display screens, etc.
Correctly understand GOB floor screen and PC mask floor screen：
PC mask floor screen
Adopt PC material imported from Germany (carbonate-based polymer).
It has high strength and elastic coefficient, high impact strength and good toughness.
High transparency and free dyeing: You can choose light brown or dark brown freely.
Low forming shrinkage: good dimensional stability and low coefficient of thermal expansion and contraction.
Good fatigue resistance: increase the adhesive, good toughness, and it is not easy to produce cracks after repeated use.
Good weather resistance: It is not prone to discoloration or cracking due to changes in temperature.
Customized by private model to increase the surface of the water guide to be non-slip. The surface is frosted, wear-resistant and scratch-resistant.
The combination of the mask and the bottom case completely wraps the PCB, and then performs special sealing treatment to make the module completely waterproof.
For safety reasons, the mask is frosted, and brown or dark brown is used to ensure the consistency of the screen surface, resulting in a loss of brightness and color reproduction.
The surface of the module is frosted to increase the friction and prevent the screen from being scratched and affecting the overall effect.
PCB suspension treatment: the PCB is suspended and not in contact with the mask to prevent the force on the surface of the screen from being applied to the PCB.
The module size is standard 250mm*250mm. In order to ensure the stability of the product, the module adopts a fully enclosed structure, so there is a modular problem due to physical factors.
The mask is detachable, which is convenient for module maintenance.
GOB floor screen
The glue itself has high strength, but because the glue is in direct contact with the lamp bead, it cannot withstand excessive force, which affects the load-bearing.
The glue has good transparency and high color reproduction.
The surface glue’s thermal expansion coefficient is large, and the module shrinks seriously. Therefore, a certain gap should be reserved between the module and the cabinet and between the modules to prevent the modules from squeezing each other when they expand.
The maintainability is poor, once the defect occurs, the maintenance is very troublesome.
The surface glue’s thermal expansion coefficient is large, and the lamp bead is in complete contact with it. The expansion of the glue will directly affect the lamp bead and thus affect its life.
The surface is a smooth glue, and the scratches are very obvious. Once there is water or liquid wine on the screen, the surface of the screen is not slippery, which seriously affects the safety of users.
The glue needs to be removed for maintenance. After the repair is completed, the glue needs to be replenished. After the glue is replenished, the color cannot be the same as before, and there is a color difference.
It has high strength and elastic coefficient, high impact strength and good toughness.
The glue is in direct contact with the lamp beads, and the force on the surface of the screen is directly applied to the lamp beads, thus affecting the product life.
There is no requirement for the size of the module. Due to the large thermal expansion coefficient, the modularization problem still exists.
Post time: Mar-05-2024
