As LED display screens are more widely used, people have higher requirements for product quality and display effects. In the packaging process, traditional SMD technology can no longer meet the application requirements of some scenarios. Based on this, some manufacturers have changed the packaging track and chosen to deploy COB and other technologies, while some manufacturers have chosen to improve SMD technology. Among them, GOB technology is an iterative technology after the improvement of SMD packaging process.
So, with GOB technology, can LED display products achieve wider applications? What trend will the future market development of GOB show? Let’s take a look!
Since the development of the LED display industry, including COB display, a variety of production and packaging processes have emerged one after another, from the previous direct insertion (DIP) process, to the surface mount (SMD) process, to the emergence of COB packaging technology, and finally to the emergence of GOB packaging technology.
⚪What is COB packaging technology?
COB packaging means that it directly adheres the chip to the PCB substrate to make electrical connections. Its main purpose is to solve the heat dissipation problem of LED display screens. Compared with direct plug-in and SMD, its characteristics are space saving, simplified packaging operations, and efficient thermal management. Currently, COB packaging is mainly used in some small-pitch products.
What are the advantages of COB packaging technology?
1. Ultra-light and thin: According to the actual needs of customers, PCB boards with a thickness of 0.4-1.2mm can be used to reduce the weight to at least 1/3 of the original traditional products, which can significantly reduce the structural, transportation and engineering costs for customers.
2. Anti-collision and pressure resistance: COB products directly encapsulate the LED chip in the concave position of the PCB board, and then use epoxy resin glue to encapsulate and cure. The surface of the lamp point is raised into a raised surface, which is smooth and hard, resistant to collision and wear.
3. Large viewing angle: COB packaging uses shallow well spherical light emission, with a viewing angle greater than 175 degrees, close to 180 degrees, and has a better optical diffuse color effect.
4. Strong heat dissipation ability: COB products encapsulate the lamp on the PCB board, and quickly transfer the heat of the wick through the copper foil on the PCB board. In addition, the thickness of the copper foil of the PCB board has strict process requirements, and the gold sinking process will hardly cause serious light attenuation. Therefore, there are few dead lamps, which greatly extends the life of the lamp.
5. Wear-resistant and easy to clean: The surface of the lamp point is convex into a spherical surface, which is smooth and hard, resistant to collision and wear; if there is a bad point, it can be repaired point by point; without a mask, dust can be cleaned with water or cloth.
6. All-weather excellent characteristics: It adopts triple protection treatment, with outstanding effects of waterproof, moisture, corrosion, dust, static electricity, oxidation, and ultraviolet; it meets all-weather working conditions and can still be used normally in a temperature difference environment of minus 30 degrees to plus 80 degrees.
⚪What is GOB packaging technology?
GOB packaging is a packaging technology launched to address the protection issues of LED lamp beads. It uses advanced transparent materials to encapsulate the PCB substrate and LED packaging unit to form effective protection. It is equivalent to adding a layer of protection in front of the original LED module, thereby achieving high protection functions and achieving ten protection effects including waterproof, moisture-proof, impact-proof, bump-proof, anti-static, salt spray-proof, anti-oxidation, anti-blue light, and anti-vibration.
What are the advantages of GOB packaging technology?
1. GOB process advantages: It is a highly protective LED display screen that can achieve eight protections: waterproof, moisture-proof, anti-collision, dust-proof, anti-corrosion, anti-blue light, anti-salt, and anti-static. And it will not have a harmful effect on heat dissipation and brightness loss. Long-term rigorous testing has shown that shielding glue even helps dissipate heat, reduces the necrosis rate of lamp beads, and makes the screen more stable, thereby extending the service life.
2. Through GOB process processing, the granular pixels on the surface of the original light board have been transformed into an overall flat light board, realizing the transformation from point light source to surface light source. The product emits light more evenly, the display effect is clearer and more transparent, and the product’s viewing angle is greatly improved (both horizontally and vertically can reach nearly 180°), effectively eliminating moiré, significantly improving the product contrast, reducing glare and glare, and reducing visual fatigue.
⚪What is the difference between COB and GOB?
The difference between COB and GOB is mainly in the process. Although the COB package has a flat surface and better protection than the traditional SMD package, the GOB package adds a glue filling process on the surface of the screen, which makes the LED lamp beads more stable, greatly reduces the possibility of falling off, and has stronger stability.
⚪Which one has advantages, COB or GOB?
There is no standard for which is better, COB or GOB, because there are many factors to judge whether a packaging process is good or not. The key is to see what we value, whether it is the efficiency of LED lamp beads or the protection, so each packaging technology has its advantages and cannot be generalized.
When we actually choose, whether to use COB packaging or GOB packaging should be considered in combination with comprehensive factors such as our own installation environment and operating time, and this is also related to the cost control and display effect.
Post time: Feb-06-2024
